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Development status of technologies

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Starting as a small department dedicated to R&D, the R&D center for FPD parts was open officially in January 2008. Based on FPD processing technology, the R&D center spares no effort to develop new products and create a workplace where both customers and employees are satisfied.

To secure technology for FPCBs which are core part to produce small and light flat displays, NOVATECH has developed independently 50um-FPCBs for COF-PDP panel operation circuits to enable direct connections. Since then, NOVATECH has entered LCD module business and developed LCD modules based on COG and COF manufacturing technology. While carrying out the LCD module project, NOVATECH developed ultra small camera modules for cellular phones to make the best of developed technology and accumulate technology. However, as the LCD market becomes mature, NOVATECH finds it difficult to create profits there. So, with the need to enter the blue ocean, NOVATECH is eyeing for the OLED business.

Early Products (2001~2003)
R&D Status, Light Flat Displays
FPCB for PDP
R&D Status, Light Flat Displays
LCD Module for Cellular Phones
R&D Status, Light Flat Displays
Ultra Small Camera Module


From the early days, NOVATECH has been developing businesses based on FPD technology. In September 2003, NOVATECH started to focus on glass etching technology for the OLED and succeed in developing competitive products.

Year Technology Description Development Type
2002 1. PDP for FPCB
2. HTPS-based TFT-LCD Module
3. COF-based Direct Bonding

  30um FPCB
0.9~1.2inch LCD Module
Direct Bonding Under Low Temperatures
  Independent
Independent
Joint

 
2003
4. Camera Module for Cellular Phones
5. Mask Material for Glass Pattern Processing

 
0.1t Super Slim Module
Material with acid resistance and for easy peeling
 
Independent
Joint

 
2004 6. High Precision Alignment for Glass to Mask
7. Highly Transparent Glass Etching
8. In-Glass Marking Technology and Equipment
9. EG Production Technology for 370*470mm OLED
10. Glass Rinse Technology and Equipment
  Under 10um Align
Highly Transparent Etching Liquid
0.5t Glass Inside Marking
3747 EG Production Facility

Glass Rinse and Facility
  Joint
Independent
Independent
Independent

Independent
 
2005 11. Glass Hole Processing (Etching/Sanding)
12. Entire Glass Sliming Technology

  Holes with a Diameter of Over 1mm
Technology and Equipment to Process
  Independent
Independent

 
2006 13. 730*460mm EG Technology and Equipment
14. Entire Sliming Technology and Facility for 730*460mm Glass
15.Large Surface & High Precision Glass Pattern Forming(Technology Innovation Project: SMBA)
  7346 EG Production
7346 Slimming Facility

730*920mm, 50um Pattern Accuracy
  Independent
Independent

Independent

 
2007 16. Large and Slim Glass Production Technology and Facility
17. Fully-Automated Technology for Mass Production
  730*920mm Automatic Production Facility
730*920mm Automatic Production Facility
  Independent

Independent

 
2009 18. Slimming Jig development for on side etching
19. Slimming Device Development including Filtering system
20. Developing technology for scribing and Surface treating process
21. Developing technology for auto
Measuring thickness of FPD
  30um FPCB
0.9~1.2inch LCD Module
Direct Bonding Under Low Temperatures
Slimming Jig development
enabling one side etching
Developing filtering system recyclable
Manufacturing the device
measuring the thickness of Combined Glass
  Independent
Co Development
Co Development
Co Development
 
2010 22. Developing technology for Slimming Si Wafer for Semi Conductor
23. Developing manufacturing technology of Base plate for PDP for PID purpose
24. Developing technology of forming Layer for low temperature ITO

25. Developing technology of chemical reinforcing solidity of Large Area Glass
26. Developing manufacturing technology of base plate for OLED lighting
  Technology for etching 300mm Si Wafer
Technology for Glass Patterning

Tech for forming layer in Low temperature ITO in 4th generation Glass
Reinforcing 4th generation Glass

Glass process technology enabling High Efficiency Optic abstraction
  Independent

Independent

Co Development

Independent

Co Development
 
2011 27. TSP integrated Encapsulation glass module for OLED
28. Large area touch sensor panel
  ON Cell Type TSP panel

More than 30 inch
  Joint

Joint