Film for semiconductor processing

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Product Introduction

Film for semiconductor processing

For wafer back grinding
  • For wafer back grinding
  • Minimize TTV of wafers after back grinding
  • For solder bumpers / For gold bu bumpers
For wafer / PKG dicing
  • UV Type / Non UV Type
  • Excellent chip flying stability

그누보드5
  • Novatech Industry Tel : 041-414-1521 Fax : 041-414-1522
  • 371 Yeongok-gil, Ipjang-myeon, Seobuk-gu, Cheonan-si, Chungcheongnam-do
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